Comparison tests of loop heat pipes with flat evaporators of different types

被引：9

作者：

Maydanik, Yu F. ^{[1
]}

Vershinin, S. V. ^{[1
]}

Chernysheva, M. A. ^{[1
]}

机构：

[1] Russian Acad Sci, Inst Thermal Phys, Ural Branch, 107a Amundsena St, Ekaterinburg 620016, Russia

来源：

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | 2022年 / 186卷

关键词：

Loop heat pipe; Flat evaporator; Thermal resistance; Heat flux; Electronics cooling; DISK-SHAPED EVAPORATOR; SIMULATION;

D O I：

10.1016/j.ijheatmasstransfer.2021.122491

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Comparison tests have been conducted on a flat-oval evaporator with a longitudinal replenishment of the evaporation zone with a working fluid (ELR) measuring 110 x 50.5 x 10 mm(3) and a flat disk-shaped evaporator with opposite replenishment (EOR) 50 mm in diameter and 19 mm in thickness. The evaporators have been tested as parts of copper-water loop heat pipes (LHPs) with identical design parameters, with a heat source of 40 x 40 mm(2) at a heat sink temperature of 40 degrees C. It is shown that an LHP with an ELR has a significantly lower operating temperature in the whole range of heat loads. The maximum heat load of the device with an ELR was 800 W at an evaporator temperature of 109.5 degrees C and with an EOR it was 600 W at a temperature of 121.1 degrees C. The corresponding thermal resistances of the evaporators were 0.025 degrees C/W and 0.046 degrees C/W. At a nominal heat load of 300 W the ELR temperature was 70.2 degrees C and the EOR temperature 87.4 degrees C . The devices were designed for use in energy-efficient cooling systems for high-power electronics. A computer simulation of heat exchange processes in the evaporators was carried out taking into account parasitic heat flows into the compensation chamber. (c) 2021 Elsevier Ltd. All rights reserved.

引用

页数：11

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