Growth kinetics of titanium boride layers on the surface of Ti6Al4V

被引：43

作者：

Li, Fenghua ^{[1
]}

Yi, Xiaohong ^{[1
]}

Zhang, Jinglei ^{[1
]}

Fan, Zhanguo ^{[1
]}

Gong, Dianting ^{[2
]}

Xi, Zhengping ^{[3
]}

机构：

[1] Northeastern Univ, Sch Met & Mat, Shenyang 110819, Peoples R China

[2] Liaoning Shihua Univ, Vocat Technol Coll, Fushun 113001, Peoples R China

[3] NW Inst Nonferrous Met Res, Xian 710016, Peoples R China

来源：

ACTA METALLURGICA SINICA-ENGLISH LETTERS | 2010年 / 23卷 / 04期

关键词：

Bonding; Powder-pack method; Ti6Al4V alloy; Kinetics; Diffusion; MICROSTRUCTURE; CVD;

D O I：

10.11890/1006-7191-104-293

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

Dual titanium boride layers consisting of continuous TiB2 top-layer and TiB whisker sub- layer were formed on the surface of Ti6Al4V alloy using powder-pack bonding technique. An iso-thickness diagram of the whole boride layer was fitted with the data of thickness of the coating, treatment time and process temperature using Sigma Plot10.0 software. Growth kinetics of the titanium boride layer were analyzed by measuring the extent of penetration of TiB2 and TiB whisker as a function of bonding time in the range of 5-20 h and bonding temperature in the range of 1000-1100 degrees C. By the linear regression analysis of growth kinetics of titanium boride layer, the diffusivity K and average diffusion activation energy (Q) of boron atoms in Ti6Al4V alloy were calculated, respectively.

引用

页码：293 / 300

页数：8

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