Effects of system dynamics and applied force on adhesion measurement in colloidal probe technique

被引:8
作者
Lee, Jaeho [1 ]
Maharjan, Jayendra [1 ]
He, Muyang [1 ]
Yeo, Chang-Dong [1 ]
机构
[1] Texas Tech Univ, Dept Mech Engn, Lubbock, TX 79409 USA
关键词
Dynamic adhesion; Pull-off force; Pull-in force; Colloidal probe technique; Sliding; SURFACE-ENERGY; CONTACT; AFM; STICTION;
D O I
10.1016/j.ijadhadh.2015.04.004
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
Dynamic pull-in/pull-off forces were quantitatively measured using an AFM colloidal probe technique. Two spherical colloids made of silicon dioxide (SiO2) and gold (Au) that were attached to an AFM cantilever were approached to and retracted from a silicon wafer specimen, where the speed of tip approaching/retracting (i.e., vertical dynamics) and specimen sliding (i.e., horizontal dynamics) was controlled. First, when the vertical dynamics of colloidal tip was applied on the stationary silicon wafer specimen, it was observed that the slower tip approaching showed higher pull-in force, while the pull-off force was dependent on both the applied force and the retracting speed. For the two colloidal tips, it was found that the higher applied force and the faster tip retraction led to the higher pull-off force. Next, under the constant speed of tip approach and retraction, horizontal dynamics was applied to the silicon wafer specimen. It was observed that the horizontal motion of the specimen made the pull-off force lower, which could be attributed to the breakage of adhesive asperity junctions at the interface. The pull-off force was further decreased at faster horizontal motion of the specimen due to the longer sliding distance. Therefore, from the systematic experiments of dynamic adhesion measurement, it could be known that if a micro/nano-system is under dynamic surface interaction, its adhesive force cannot be fully described by a conventional quasi-static adhesion model but it should include the effects of applied system dynamics in both normal and tangential directions. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码:109 / 116
页数:8
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