Development of a flux-less soldering method by ultrasonic modulated laser

被引：26
作者：
Li, MY
Wang, CQ
Bang, HS
Kim, YP
机构：
[1] Shenzhen Grad Sch, Harbin Inst Technol, Xili 518055, Shenzhen, Peoples R China
[2] Chosun Univ, Dept Naval Architecture & Ocean Engn, Kwangju 501759, South Korea
来源：
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY | 2005年 / 168卷 / 02期
基金：
中国国家自然科学基金;
关键词：
flux-less soldering; modulated laser; numerical analysis; ultrasonic cavitation;
D O I：
10.1016/j.jmatprotec.2005.02.237
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Solder wetting behavior on pad was studied under continuous and ultrasonic modulated laser with an 8 Pa low vacuum condition. Based on these results, a novel ultrasonic modulated laser flux-less soldering method was put forward and its mechanism was also investigated in detail. Ultrasonic oscillation of temperature field, which resulted in an ultrasonic vibration of the surface of the solder droplet, was generated at the surface of the solder droplet induced by the heating of the ultrasonic modulated laser. The ultrasonic cavitation phenomenon was appeared at the solder wetting interface when the surface ultrasonic vibration was transmitted to the inside of the solder droplet, which force the molten solder to wet on the pad. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码：303 / 307
页数：5
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