Failure analysis and case study of wire bonding

被引：0

作者：

Ma, Lili ^{[1
]}

Chen, Hang ^{[1
]}

机构：

[1] Ceprei Lab, Reliabil Res & Anal Ctr, Guangzhou, Guangdong, Peoples R China

来源：

2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2018年

基金：

国家重点研发计划;

关键词：

wire bonding; reliability; failure analysis;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Wire bonding is one of the most important processes in electronics packaging, and it is reliable and low cost comparing to the other interconnection process. The wire bonding process influences the reliability and the cost of integrated circuit and device directly, and it was irreparable for plastic package component. In this paper, some wire bonding failure case was studied and the failure mechanism was discussed. Finally, some measures should be taken to minimize such failures.

引用

页码：728 / 730

页数：3

共 7 条

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