Effect of 0.5 wt% Cu in Sn-3.5%Ag solder balls on the solid state interfacial reaction with Au/Ni/Cu bond pads for ball grid array (BGA) applications

被引：28

作者：

Alam, M

Chan, YC

Tu, KN

Kivilahti, JK

机构：

[1] City Univ Hong Kong, Dept Elect Engn, Kowloon, Hong Kong, Peoples R China

[2] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA

[3] Aalto Univ, Dept Elect & Commun Engn, FIN-02015 Helsinki, Finland

来源：

CHEMISTRY OF MATERIALS | 2005年 / 17卷 / 09期

关键词：

D O I：

10.1021/cm0478069

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Effect of 0.5 wt% Cu in Sn-3.5%Ag Solder Balls on the Solid State Interfacial Reaction with Au/Ni/Cu Bond Pads for Ball Grid Array (BGA) Applications Cross-sectional SEM-BSE image of the Sn3.5%Ag-0.5%Cu solder interface showing a high magnification microstructure of the rapid variation of the thick and thin IMC layer.

引用

页码：2223 / +

页数：5

共 16 条

[1]

Alam MO, 2004, J MATER RES, V19, P1303, DOI [10.1557/JMR.2004.0170, 10.1557/jmr.2004.0170]

[2] Effect of 0.5 wt % Cu addition in Sn-3.5%Ag solder on the dissolution rate of Cu metallization [J].