The graded structure of functionally graded materials can greatly reduce the residual thermal stress compared with non-graded interface of directly jointed materials. Finite element analysis was conducted to study the residual thermal stress induced on cooling from the sintering temperature of Ti3SiC2-(Ti3SiC2-SiC) FMGs. For a circular disk shaped specimen with a fixed geometric size of Ti3SiC2-(Ti3SiC2-SiC) FMGs, optimum grade layer number N as well as composition distribution exponent p for minimising residual stress is identified. The simulation results indicated that the optimum layer number N and composition distribution exponent p can not only reduce the stress level, but also make the stress distribute more uniformly.
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页码:276 / 282
页数:7
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[1]
BAHR HA, 2006, MAT SCI ENG A-STRUCT, V362, P2
[2]
Barsoum MW, 1997, J MATER SYNTH PROCES, V5, P197