Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling

被引：3

作者：

Sharma, Ashutosh ^{[1
,2
]}

Oh, Min Chul ^{[1
,2
,3
]}

Chae, Myoung Jin ^{[1
,2
]}

Seo, Hyungtak ^{[1
,2
]}

Ahn, Byungmin ^{[1
,2
]}

机构：

[1] Ajou Univ, Dept Energy Syst Res, Suwon 16499, South Korea

[2] Ajou Univ, Dept Mat Sci & Engn, Suwon 16499, South Korea

[3] Korea Inst Ind Technol, Met Forming Technol R&D Grp, Incheon 21999, South Korea

来源：

METALS | 2020年 / 10卷 / 03期

关键词：

high-energy ball milling; soldering; joining; microstructure; interface; SN-AG-CU; FREE SOLDER ALLOYS; NANOPARTICLES; TEMPERATURE; ADDITIONS; GROWTH; ZN;

D O I：

10.3390/met10030370

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this work, we have investigated the role of high-energy ball milling (HEBM) on the evolution of microstructure, thermal, and wetting properties of an Sn-0.7Cu alloy. We ball-milled the constituent Sn and Cu powders in eutectic composition for 45 h. The microstructural studies were carried out using optical and scanning electron microscopy. The melting behavior of the powder was examined using differential scanning calorimetry (DSC). We observed a considerable depression in the melting point of the Sn-0.7Cu alloy (approximate to 7 degrees C) as compared to standard cast Sn-0.7Cu alloys. The resultant crystallite size and lattice strain of the ball-milled Sn-0.7Cu alloy were 76 nm and 1.87%, respectively. The solderability of the Sn-0.7Cu alloy was also improved with the milling time, due to the basic processes occurring during the HEBM.

引用

页数：11

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