Design and Fabrication of Wafer Level Dual-Band Thin Film Bulk Acoustic Resonator Filters

被引:0
作者
Chang, Wei-Tsai [2 ]
Chen, Ying-Chung [2 ]
Cheng, Chien-Chuan [1 ]
Kao, Kuo-Sheng [3 ]
Lin, Re-Ching [4 ]
Li, Jia-Ming [2 ]
机构
[1] De Lin Inst Technol, Dept Elect Engn, Taipei, Taiwan
[2] Natl Sun Yat Sen Univ, Dept Elect Engn, Kaohsiung, Taiwan
[3] Shu Te Univ, Dept Comp & Commun, Kaohsiung, Taiwan
[4] Natl Chung Hsing Univ, Dept Mat Sci & Engn, Tainan, Taiwan
来源
ADVANCED DESIGN TECHNOLOGY, PTS 1-3 | 2011年 / 308-310卷
关键词
ZnO; wafer level; dual-mode TFBAR; filter; ZNO;
D O I
10.4028/www.scientific.net/AMR.308-310.201
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper describes the design and fabrication of dual-mode film bulk acoustic resonator (TFBAR) devices to construct wafer level dual-band T-ladder type filters. The T-ladder type filters is selected in this study for its high quality and simple fabrication processes. The c-axis-tilted ZnO thin films to obtain dual-mode TFBAR devices have been investigated. The characteristics of dual-mode TFBAR devices appeared by off-axis deposition of ZnO thin films with the RF magnetron sputtering. The top and bottom electrodes consisted of titanium (Ti) and platinum (Pt) layers are deposited by dual-gun DC sputtering system. The pass-band width of filters is controlled by the mass loading on the dual-mode. The frequency response is measured using an HP8720 network analyzer and a CASCADE probe station.
引用
收藏
页码:201 / +
页数:2
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