共 50 条
[41]
Grain boundary character distribution in electroplated nanotwinned copper
[J].
Journal of Materials Science,
2017, 52
:4070-4085
[42]
ELASTIC GRAIN-BOUNDARY RESPONSES IN COPPER AND ALUMINUM
[J].
ACTA METALLURGICA,
1977, 25 (03)
:309-319
[43]
Dynamic twin nucleation at grain boundary in copper bicrystal
[J].
RECRYSTALLIZATION AND GRAIN GROWTH, PTS 1 AND 2,
2004, 467-470
:1217-1222
[44]
Measurement of grain boundary triple line energy in copper
[J].
ACTA MATERIALIA,
2010, 58 (17)
:5646-5653
[46]
ANALYSIS OF GRAIN-BOUNDARY CAVITATION DAMAGE IN COPPER
[J].
TEXTURES AND MICROSTRUCTURES,
1991, 14
:977-982
[49]
GRAIN-BOUNDARY DIFFUSION DURING THE CREEP OF COPPER
[J].
SOVIET PHYSICS-SOLID STATE,
1961, 2 (12)
:2691-2699