Spatial Electro-Thermal Modeling and Simulation of Power Electronic Modules

被引:69
作者
van der Broeck, Christoph H. [1 ]
Ruppert, Lukas A. [1 ]
Hinz, Arne [1 ]
Conrad, Marcus [1 ,2 ]
De Doncker, Rik W. [1 ]
机构
[1] Rhein Westfal TH Aachen, Inst Power Elect & Elect Drives ISEA, D-52066 Aachen, Germany
[2] AixControl GmbH, D-52070 Aachen, Germany
关键词
Insulated-gate bipolar transistor (IGBT) loss modeling; model reduction techniques; power modules; thermal modeling; THERMAL COMPONENT MODEL; LOSSES;
D O I
10.1109/TIA.2017.2757898
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this work, the spatial electro-thermal modeling and simulation of power electronic modules is discussed. It is shown how physical and mathematical modeling techniques can be combined to obtain a compact time-efficient electro-thermal simulation framework for power electronic modules. The accuracy of the modeling framework is demonstrated based on experiments. It can be used for the fast calculation of the temperature distribution of a power module in an electric vehicle over driving cycles. The spatial temperature information allows to effectively estimate the lifetime of the power module.
引用
收藏
页码:404 / 415
页数:12
相关论文
共 24 条
[1]  
[Anonymous], 2012, Linear Robust Control
[2]  
[Anonymous], 2004, THESIS
[3]  
[Anonymous], 1989, DIGITAL CONTROL SYST
[4]   A 3-D-Lumped Thermal Network Model for Long-Term Load Profiles Analysis in High-Power IGBT Modules [J].
Bahman, Amir Sajjad ;
Ma, Ke ;
Ghimire, Pramod ;
Iannuzzo, Francesco ;
Blaabjerg, Frede .
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2016, 4 (03) :1050-1063
[5]  
Bierhoff MH, 2004, IEEE POWER ELECTRON, P2836
[6]  
Blaabjerg F, 1996, IEEE IND APPLIC SOC, P1454, DOI 10.1109/IAS.1996.559258
[7]  
Engelmann G., 2016, P 17 INT C POW EL MO, P957
[8]  
Gottschlich J, 2015, INT C POWER ELECT DR, P442, DOI 10.1109/PEDS.2015.7203495
[9]   Innovative and Reliable Power Modules A Future Trend and Evolution of Technologies [J].
Neeb, Christoph ;
Boettcher, Lars ;
Conrad, Marcus ;
De Doncker, Rik W. .
IEEE INDUSTRIAL ELECTRONICS MAGAZINE, 2014, 8 (03) :6-16
[10]  
Nellis G, 2009, HEAT TRANSFER-BOOK, P1