A comparative study of conventional and high speed grinding characteristics of a thin film multilayer structure

被引：13

作者：

Kang, Chengwei ^{[1
]}

Huang, Han ^{[1
]}

机构：

[1] Univ Queensland, Sch Mech & Min Engn, Brisbane, Qld 4072, Australia

来源：

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY | 2017年 / 50卷

关键词：

Multilayer; Thin film; High speed grinding; Interface; Delamination; FEM; SILICON-NITRIDE; MACHINING CHARACTERISTICS; TETRAGONAL ZIRCONIA; REMOVAL MECHANISMS; BRITTLE MATERIALS; DAMAGE FORMATION; DIAMOND WHEELS; DUCTILE-REGIME; TECHNOLOGY; GLASS;

D O I：

10.1016/j.precisioneng.2017.05.010

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

High speed and conventional speed grinding characteristics of a thin film multilayer solar panel were investigated. The grinding force and surface roughness were measured and the interface integrity of the ground workpieces was examined. The results indicated that when applying a high wheel speed of up to 120 m/s, the ground surfaces predominantly exhibited ductile flow and the interface integrity was significantly improved. The maximum undeformed chip thickness was found to be an important parameter to measure grinding performance and interfacial failure. Delamination was observed at interfaces when the maximum undeformed chip thickness exceeded a threshold value and the finite element method (FEM) analysis revealed that the interfacial failure was mainly induced by shear stress. (C) 2017 Elsevier Inc. All rights reserved.

引用

页码：222 / 234

页数：13

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