On the Hall-Petch relationship in a nanostructured Al-Cu alloy

被引:209
作者
Shanmugasundaram, T. [1 ]
Heilmaier, M. [1 ]
Murty, B. S. [2 ]
Sarma, V. Subramanya [2 ]
机构
[1] Tech Univ Darmstadt, Dept Mat Sci, D-64287 Darmstadt, Germany
[2] Indian Inst Technol, Dept Met & Mat Engn, Chennai 600036, Tamil Nadu, India
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2010年 / 527卷 / 29-30期
关键词
Aluminum alloys; Mechanical alloying; Nanostructured materials; Hot pressing; Hall-Petch relation; ULTRAFINE-GRAINED ALUMINUM; MECHANICAL-PROPERTIES; DEFORMATION; EXTRUSION; BEHAVIOR; POWDER;
D O I
10.1016/j.msea.2010.08.070
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Mechanical properties of bulk nanocrystalline Al-4Cu alloys with grain sizes from 47 to 105 nm, synthesized by mechanically alloying followed by vacuum hot pressing at different temperatures, were analysed through Hall-Petch relation. Hall-Petch analysis revealed a high frictional stress (170 MPa) and a high positive slope (0.13 MPa root m) as compared to pure Al, which has a frictional stress (15-30 MPa) and a slope (0.06-0.09 MPa root m). From a detailed evaluation of different strengthening mechanisms it is inferred that the Al(2)Cu precipitates and oxide particles are the likely reason for such high values of frictional stress and slope. (C) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码:7821 / 7825
页数:5
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