Characteristics of silicon substrates fabricated using nanogrinding and chemo-mechanical-grinding

被引：88

作者：

Huang, H. ^{[1
]}

Wang, B. L. ^{[1
]}

Wang, Y. ^{[1
]}

Zou, J. ^{[1
,2
]}

Zhou, L. ^{[3
]}

机构：

[1] Univ Queensland, Sch Engn, Brisbane, Qld 4072, Australia

[2] Univ Queensland, Ctr Microscopy & Microanal, Brisbane, Qld 4072, Australia

[3] Ibaraki Univ, Fac Engn, Hitachi, Ibaraki 3168511, Japan

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2008年 / 479卷 / 1-2期

基金：

澳大利亚研究理事会;

关键词：

CMG; grinding; silicon; subsurface damage; nanoindentation; nanoscratch;

D O I：

10.1016/j.msea.2007.06.061

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

In this paper, the silicon substrates machined by nanogrinding and chemo-mechanical-grinding (CMG) were characterized using atomic force microscopy, transmission electron microscopy and instrumented nanomechanical tests. It was found that the nanogrinding-generated silicon subsurfaces consisted of an amorphous layer and a damaged crystalline layer underneath, but the CMG-generated subsurface was defect-free. The formation of the amorphous and damaged crystalline layers was dependent on the maximum undeformed chip thickness involved in the nanogrinding process. Nanoindentation and nanoscratch tests revealed that the amorphous silicon exhibited to be more plastically deformed than the damaged crystalline layer under the same loading condition. (C) 2007 Elsevier B.V. All rights reserved.

引用

页码：373 / 379

页数：7

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