A 512-Gb 3-b/Cell 64-Stacked WL 3-D-NAND Flash Memory

被引:84
作者
Kim, Chulbum [1 ]
Kim, Doo-Hyun [1 ]
Jeong, Woopyo [1 ]
Kim, Hyun-Jin [1 ]
Park, Il Han [1 ]
Park, Hyun-Wook [1 ]
Lee, JongHoon [1 ]
Park, JiYoon [1 ]
Ahn, Yang-Lo [1 ]
Lee, Ji Young [1 ]
Kim, Seung-Bum [1 ]
Yoon, Hyunjun [1 ]
Yu, Jae Doeg [1 ]
Choi, Nayoung [1 ]
Kim, NaHyun [1 ]
Jang, Hwajun [1 ]
Park, JongHoon [1 ]
Song, Seunghwan [1 ]
Park, YongHa [1 ]
Bang, Jinbae [1 ]
Hong, Sanggi [1 ]
Choi, Youngdon [1 ]
Kim, Moo-Sung [1 ]
Kim, Hyunggon [1 ]
Kwak, Pansuk [1 ]
Ihm, Jeong-Don [1 ]
Byeon, Dae Seok [1 ]
Lee, Jin-Yub [1 ]
Park, Ki-Tae [1 ]
Kyung, Kye-Hyun [1 ]
机构
[1] Samsung Elect Co Ltd, Flash Prod & Technol, Memory Business, Hwaseong 445701, South Korea
关键词
3-bit per cell; 3-D NAND; 64 word-line(WL) stack; cache program; error correction; NAND flash memory; reliability; self IO test; V-NAND;
D O I
10.1109/JSSC.2017.2731813
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A 64-word-line-stacked 512-Gb 3-b/cell 3-D NAND flash memory is presented. After briefly examining the challenges that occur to a stack, several technologies are suggested to resolve the issues. For performance enhancement, a novel program method hiding two-page data loading time is presented. This paper also discusses an electrical annealing improving reliability characteristic by removing holes in shallow traps. In addition, a valley tracking read for reducing timing overhead at a read retry is introduced by fast finding optimal read levels. Finally, a high-speed self-test mode for IO operation is presented. The chip, designed with the fourth generation of V-NAND technology, achieved an areal density of 3.98 Gb/mm(2) and operated up to 1 Gb/s at 1.2 V.
引用
收藏
页码:124 / 133
页数:10
相关论文
共 17 条
  • [1] A dual-mode NAND flash memory: 1-Gb multilevel and high-performance 512-Mb single-level modes
    Cho, T
    Lee, YT
    Kim, EC
    Lee, JW
    Choi, S
    Lee, S
    Kim, DH
    Han, WG
    Lim, YH
    Lee, JD
    Choi, JD
    Suh, KD
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2001, 36 (11) : 1700 - 1706
  • [2] Choi S, 2014, ISSCC DIG TECH PAP I, V57, P328, DOI 10.1109/ISSCC.2014.6757455
  • [3] Daeyeal Lee, 2012, 2012 IEEE International Solid-State Circuits Conference (ISSCC), P430, DOI 10.1109/ISSCC.2012.6177077
  • [4] Helm M, 2014, ISSCC DIG TECH PAP I, V57, P326, DOI 10.1109/ISSCC.2014.6757454
  • [5] Im JW, 2015, ISSCC DIG TECH PAP I, V58, P130, DOI 10.1109/ISSCC.2015.7062960
  • [6] Jang J, 2009, 2009 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, P192
  • [7] 256 Gb 3 b/Cell V-NAND Flash Memory With 48 Stacked WL Layers
    Kang, Dongku
    Jeong, Woopyo
    Kim, Chulbum
    Kim, Doo-Hyun
    Cho, Yong Sung
    Kang, Kyung-Tae
    Ryu, Jinho
    Kang, Kyung-Min
    Lee, Sungyeon
    Kim, Wandong
    Lee, Hanjun
    Yu, Jaedoeg
    Choi, Nayoung
    Jang, Dong-Su
    Lee, Cheon An
    Min, Young-Sun
    Kim, Moo-Sung
    Park, An-Soo
    Son, Jae-Ick
    Kim, In-Mo
    Kwak, Pansuk
    Jung, Bong-Kil
    Lee, Doo-Sub
    Kim, Hyunggon
    Ihm, Jeong-Don
    Byeon, Dae-Seok
    Lee, Jin-Yup
    Park, Ki-Tae
    Kyung, Kye-Hyun
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2017, 52 (01) : 210 - 217
  • [8] Kang D, 2016, ISSCC DIG TECH PAP I, V59, P130, DOI 10.1109/ISSCC.2016.7417941
  • [9] Ki-Tae Park, 2011, 2011 IEEE International Solid-State Circuits Conference (ISSCC 2011), P212, DOI 10.1109/ISSCC.2011.5746287
  • [10] Lee S, 2016, ISSCC DIG TECH PAP I, V59, P138, DOI 10.1109/ISSCC.2016.7417945