A 512-Gb 3-b/Cell 64-Stacked WL 3-D-NAND Flash Memory

被引:86
作者
Kim, Chulbum [1 ]
Kim, Doo-Hyun [1 ]
Jeong, Woopyo [1 ]
Kim, Hyun-Jin [1 ]
Park, Il Han [1 ]
Park, Hyun-Wook [1 ]
Lee, JongHoon [1 ]
Park, JiYoon [1 ]
Ahn, Yang-Lo [1 ]
Lee, Ji Young [1 ]
Kim, Seung-Bum [1 ]
Yoon, Hyunjun [1 ]
Yu, Jae Doeg [1 ]
Choi, Nayoung [1 ]
Kim, NaHyun [1 ]
Jang, Hwajun [1 ]
Park, JongHoon [1 ]
Song, Seunghwan [1 ]
Park, YongHa [1 ]
Bang, Jinbae [1 ]
Hong, Sanggi [1 ]
Choi, Youngdon [1 ]
Kim, Moo-Sung [1 ]
Kim, Hyunggon [1 ]
Kwak, Pansuk [1 ]
Ihm, Jeong-Don [1 ]
Byeon, Dae Seok [1 ]
Lee, Jin-Yub [1 ]
Park, Ki-Tae [1 ]
Kyung, Kye-Hyun [1 ]
机构
[1] Samsung Elect Co Ltd, Flash Prod & Technol, Memory Business, Hwaseong 445701, South Korea
关键词
3-bit per cell; 3-D NAND; 64 word-line(WL) stack; cache program; error correction; NAND flash memory; reliability; self IO test; V-NAND;
D O I
10.1109/JSSC.2017.2731813
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A 64-word-line-stacked 512-Gb 3-b/cell 3-D NAND flash memory is presented. After briefly examining the challenges that occur to a stack, several technologies are suggested to resolve the issues. For performance enhancement, a novel program method hiding two-page data loading time is presented. This paper also discusses an electrical annealing improving reliability characteristic by removing holes in shallow traps. In addition, a valley tracking read for reducing timing overhead at a read retry is introduced by fast finding optimal read levels. Finally, a high-speed self-test mode for IO operation is presented. The chip, designed with the fourth generation of V-NAND technology, achieved an areal density of 3.98 Gb/mm(2) and operated up to 1 Gb/s at 1.2 V.
引用
收藏
页码:124 / 133
页数:10
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