共 13 条
[2]
Bracale A, 2000, IEEE MTT S INT MICR, P1481, DOI 10.1109/MWSYM.2000.862255
[3]
HIGH-SPEED VLSI INTERCONNECT MODELING BASED ON S-PARAMETER MEASUREMENTS
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1993, 16 (05)
:555-562
[4]
QUASI-ANALYTICAL ANALYSIS OF THE BROAD-BAND PROPERTIES OF MULTICONDUCTOR TRANSMISSION-LINES ON SEMICONDUCTING SUBSTRATES
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING,
1994, 17 (03)
:376-382
[6]
Marks R. B., 1991, IEEE Microwave and Guided Wave Letters, V1, P141, DOI 10.1109/75.91092
[9]
Williams D. F., 1998, 1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192), P1917, DOI 10.1109/MWSYM.1998.700955
[10]
Williams D. F., 1991, 38 ARFTG C DIG, P68, DOI [10.1109/ARFTG.1991.324040, DOI 10.1109/ARFTG.1991.324040]