Molding of Pb and Zn with microscale mold inserts

被引:26
作者
Cao, DM [1 ]
Guidry, D
Meng, WJ
Kelly, KW
机构
[1] Louisiana State Univ, Dept Mech Engn, Baton Rouge, LA 70803 USA
[2] Mezzo Syst Inc, Baton Rouge, LA 70803 USA
来源
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2003年 / 9卷 / 08期
关键词
D O I
10.1007/s00542-003-0308-9
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Molding of Pb and Zn metal plates with LiGA (Lithographie, Galvanoformung, Abformung) fabricated Ni microscale mold inserts was carried out at 300 degreesC. Both as fabricated Ni inserts and Ni inserts conformally coated with Ti-containing hydrocarbon (Ti-C:H) coatings were used. The molding performance was characterized both in terms of feature generation on the metal plates and insert condition after molding. The present results demonstrate that, in cases where significant metal/insert chemical interactions exist, surface engineering of the mold insert is necessary to obtain satisfactory performance, and that conformal deposition of suitably engineered ceramic coatings onto Ni microscale mold inserts is an effective means for achieving high temperature micromolding of reactive metals.
引用
收藏
页码:559 / 566
页数:8
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