Friction modeling in linear chemical-mechanical planarization - Process monitoring for wafer polishing in semiconductor manufacturing

被引：2

作者：

Yi, Jingang ^{[1
]}

机构：

[1] Rutgers State Univ, Dept Mech & Aerosp Engn, Piscataway, NJ 08854 USA

来源：

IEEE CONTROL SYSTEMS MAGAZINE | 2008年 / 28卷 / 05期

关键词：

D O I：

10.1109/MCS.2008.927333

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：59 / 78

页数：20

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