Investigation of hygroscopic properties in electronic packages using molecular dynamics simulation

被引：27

作者：

Chang, Seung-Hwan ^{[2
]}

Kim, Hak-Sung ^{[1
]}

机构：

[1] Hanyang Univ, Dept Mech Engn, Seoul 133791, South Korea

[2] Chung Ang Univ, Sch Mech Engn, Seoul 156756, South Korea

来源：

POLYMER | 2011年 / 52卷 / 15期

基金：

新加坡国家研究基金会;

关键词：

Hygroscopic characteristic; Swelling; Molecular dynamics; MOISTURE DIFFUSION; SYSTEM;

D O I：

10.1016/j.polymer.2011.05.056

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Moisture-induced package failures such as interfacial delamination and pop-corn cracking are common failure phenomena that occur during the solder reflow process in the semiconductor industry. Therefore, the hygroscopic properties of the package materials are crucial factors in the reliability of electronic packaging products. In this work, molecular dynamics (MD) simulation was performed to study the hygroscopic properties, including diffusivity and swelling strain, of epoxy materials with respect to temperature and moisture concentration. Hygroscopic material properties predicted by MD are discussed and compared with the experimental data. (C) 2011 Elsevier Ltd. All rights reserved.

引用

页码：3437 / 3442

页数：6

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