Bulk/Surface Micromachined PolyMEMS Test Chip for the Characterization of Electrical, Mechanical and Thermal Properties

被引：0

作者：

Quinones-N, F. J. ^{[1
]}

Diaz-A, D. ^{[1
]}

Calleja-A, W. ^{[1
]}

De la Hidalga-W, F. J. ^{[1
]}

Malik, O. ^{[1
]}

Reyes-B, C. ^{[1
]}

Molina-R, J. ^{[1
]}

Moreno-M, M. ^{[1
]}

Zuniga-, C., I ^{[1
]}

Rosales-Q, P. ^{[1
]}

机构：

[1] INAOE, Dept Elect, Puebla, Mexico

来源：

2014 INTERNATIONAL CARIBBEAN CONFERENCE ON DEVICES, CIRCUITS AND SYSTEMS (ICCDCS) | 2014年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work we present the design and fabrication of a test chip to be used for the characterization of the main electrical, mechanical and thermal properties of the structural materials involved in the development of polysilicon-based electrothermal actuators. With this combined bulk/surface micromachined chip, parameters such as Young's modulus (E), stretching or compression stresses (+/-sigma), stress gradients (+/- Delta epsilon), electrical resistivity (rho e), doping level (n+), thermal conductivity (kappa), and thermal capacitance (C) can be obtained. This test chip was fabricated using the PolyMEMS-INAOE fabrication process, in which the main materials involved are silicon oxide, silicon nitride, phosphosilicate glass, aluminum, mono- and poly-crystalline silicon. In this combined micromachining technology, the polysilicon film is the main structural material and it is used to build the mechanical actuators.

引用

页数：6

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