A 1 &x00D7; 2 Taper Slot Antenna Array With Flip-Chip Interconnect via Glass-IPD Technology for 60 GHz Radar Sensors

被引:10
作者
Xia, Haiyang [1 ,2 ]
Zhang, Tao [2 ,3 ]
Li, Lianming [1 ,2 ]
Zheng, Fu-Chun [1 ,2 ]
机构
[1] Southeast Univ, Natl Mobile Commun Res Lab, Nanjing 210096, Peoples R China
[2] Purple Mt Labs, Nanjing 211111, Peoples R China
[3] Xidian Univ, Sch Microelect, Xian 710071, Peoples R China
关键词
60; GHz; antenna in package (AiP); CPW-slotline transition; flip-chip; glass integrated passive device (Glass-IPD); radar sensors; taper slot antenna (TSA);
D O I
10.1109/ACCESS.2020.2983485
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
A low cost, broadband and compact antenna in package solution (AiP) is proposed for 60 GHz low-power radar sensor applications. Following a glass integrated passive device (Glass-IPD) manufacturing process, a compact low cost taper slot antenna (TSA) is designed on a substrate with a thickness beyond Yngvesson & x2019;s range. To realize high gain and front-to-back ratio, the antenna is optimized by introducing a truncated ground. A antenna array prototype is realized with a dummy transmission line chip in the dimension of mm(2). Including the flip chip interconnect, the measured results demonstrate a 10 dB impedance bandwidth of GHz. The calculated gain is higher than 6.5 dBi in the end-fire direction over the entire 60 GHz band. Based on a physical RLC equivalent circuit, by co-design of the antenna with solder balls, the flip chip interconnect is compensated with a passive network. For the compensation network, its working bandwidth is from 0.1 to 67 GHz, while its insertion loss at 60 GHz is less than 0.2 dB.
引用
收藏
页码:61790 / 61796
页数:7
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