Effect of rheological parameters of conductor pastes on thick film fine line screen printing

被引：0

作者：

Hung, SH ^{[1
]}

Fuh, KF ^{[1
]}

Chen, TW ^{[1
]}

机构：

[1] Ind Technol Res Inst, Mat Res Labs, Hsinchu 310, Taiwan

来源：

CERAMIC MATERIALS AND MULTILAYER ELECTRONIC DEVICES | 2003年 / 150卷

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Various paste-printing benchmarks were performed to investigate the effects of rheological behavior on thick film fine line printing. DuPont 951 AT LTCC green tape and 6142D conductor paste were chosen to be the common evaluation platform. The rheological parameters, such as viscosity, thixotropy, yield stress and ratio of viscous property/elastic property, of each paste sample were changed by increasing solid content of the 6142D paste. The screen printing conditions of each benchmark were kept the same except for the paste samples. The experimental results show that pastes with higher viscosity, yield stress and lower ratio of viscous property/elastic will get fine line patterns with well shape and size definition.

引用

页码：309 / 318

页数：10

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