Effect of strain path on texture and annealing, microstructure development in bulk pure copper processed by simple shear

被引:69
作者
Haouaoui, M [1 ]
Hartwig, KT
Payzant, EA
机构
[1] Texas A&M Univ, Dept Engn Mech, College Stn, TX 77843 USA
[2] Oak Ridge Natl Lab, High Temp Mat Lab, Oak Ridge, TN 37831 USA
关键词
ECAE; texture; copper; recrystallization; microhardness;
D O I
10.1016/j.actamat.2004.10.032
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The objective of this study was to determine the effect of strain path on the annealing behavior and texture development of severely plastically deformed oxygen free high conductivity copper. The material was deformed via equal channel angular extrusion (ECAE) to strains of 4.6 following three routes (A. B and C). Nucleation sites after recrysiallization heat treatment start in shear bands with subsequent growth in the direction of slip lines. Processing that causes intersection of shear planes creates, more sites for nucleation and leads to a shifting of the recrystallization curve to lower temperatures. The texture after multipass: processing via A route A is found to be similar to a rolling texture. An intermediate rotation of the billet of +/-90degrees during processing (route B) is found to produce a partial fiber texture. Route C processing leads to the formation of a sheet texture which is not eliminated when a reversal strain is applied. (C) 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:801 / 810
页数:10
相关论文
共 25 条
[1]  
Agnew S.R, 1999, P ICOTOM 12, P575
[2]  
AGNEW SR, 1998, P 19 RIS INT S MAT S, P201
[3]  
BACKOFEN WA, 1950, T AM I MIN MET ENG, V188, P1454
[4]  
Barrett C., 1980, STRUCTURE METALS
[5]  
BARRETT CS, 1941, AIME T, V145, P283
[6]  
CALNAN EA, 1951, PHILOS MAG, V42, P616
[7]  
Courtney T. H., 2000, MECH BEHAV MAT
[8]  
DILLAMORE II, 1965, METALL REV, V10, P280
[9]  
ENGLER O, 1994, TEXTURES MAT ICOTOM, P679
[10]   Modelling texture development during equal channel angular extrusion of aluminium [J].
Gholinia, A ;
Bate, P ;
Prangnell, PB .
ACTA MATERIALIA, 2002, 50 (08) :2121-2136