Study of the effect of Triethanolamine as a chelating agent in the simultaneous electrodeposition of copper and zinc from non-cyanide electrolytes

被引:36
|
作者
Ramirez, C. [1 ]
Calderon, J. A. [1 ]
机构
[1] Univ Antioquia UdeA, Ctr Invest Innovat & Desarrollo Mat CIDEMAT, Calle 70 52-21, Medellin, Colombia
关键词
Electrodeposition; Cu-Zn coatings; Non-cyanide electrolytes; Triethanolamine; Alkaline bath; ALKALINE BATH; IONIC LIQUID; THIN-FILMS; ZN; DEPOSITION; ALLOYS; BRASS; REDUCTION; COATINGS; KINETICS;
D O I
10.1016/j.jelechem.2015.06.003
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
D Cu-Zn coatings were obtained from cyanide-free electrolytes containing CuSO4 center dot 5H(2)O, ZnSO4. 7H(2)O, Triethanolamine (TEA) and NaOH with different cation concentrations. Electrochemical analyses were performed using cyclic voltammetry and potentiostatic polarization in order to analyze the effect of TEA as a complexing agent of Cu2+ and Zn2+ ions and its influence on the composition of the electrodeposited films. It was observed that TEA diminishes cathodic overpotential for the reduction of Zn2+ ions and increases cathodic overpotential for the reduction of Cu2+ ions. As a consequence, the simultaneous electrodeposition of Zn2+ and Cu2+ ions was facilitated and a brass (Cu-Zn alloy) coating was obtained from non-cyanide solutions. The composition and appearance of the Cu-Zn film can be modified by optimization of the cathodic current density and the concentration of TEA, Cu and Zn in the electrolyte. The ray-X results show a Cu-Zn coating with a content of Zn > 25% from a non-cyanide electrolyte as an alloy of alpha-CuZn. From the results of this work, a promissory and environmentally friendly alternative to the electroplating bath can be developed, from which a brass alloy can be electrodeposited using a non -cyanide electrolyte. (C) 2015 Elsevier B.V. All rights reserved.
引用
收藏
页码:132 / 139
页数:8
相关论文
共 50 条
  • [31] Electrodeposition of Sn and Au–Sn alloys from a single non-cyanide electrolyte
    A. He
    D. G. Ivey
    Journal of Materials Science: Materials in Electronics, 2012, 23 : 2186 - 2193
  • [32] Obtaining electrolytic copper by the electrodeposition process using a non-cyanide bath and surface electrochemical treatment
    Pinto, Leonardo Alves
    Bandeira Barroso, Maria das Dores
    Santos, Cicero de Lima
    da Costa Agra de Melo, Joao Baptista
    Costa de Santana, Renato Alexandre
    MATERIA-RIO DE JANEIRO, 2020, 25 (02): : 1 - 9
  • [33] Investigation of Whisker Growth from Alkaline Non-cyanide Zinc Electrodeposits
    Wu, L.
    Ashworth, M. A.
    Wilcox, G. D.
    JOURNAL OF ELECTRONIC MATERIALS, 2017, 46 (02) : 1114 - 1127
  • [34] Investigation of Whisker Growth from Alkaline Non-cyanide Zinc Electrodeposits
    L. Wu
    M. A. Ashworth
    G. D. Wilcox
    Journal of Electronic Materials, 2017, 46 : 1114 - 1127
  • [35] A new brightener for zinc plating from non-cyanide alkaline bath
    Naik, YA
    Venkatesha, TV
    INDIAN JOURNAL OF ENGINEERING AND MATERIALS SCIENCES, 2003, 10 (04) : 318 - 323
  • [36] New non-cyanide acidic copper electroplating bath based on glutamate complexing agent
    Ibrahim, M. A. M.
    Bakdash, R. S.
    SURFACE & COATINGS TECHNOLOGY, 2015, 282 : 139 - 148
  • [37] Electrocristallization of Copper from Non-Cyanide Alkaline Solution Containing Glycine
    Ballesteros, J. C.
    Chainet, E.
    Ozil, P.
    Meas, Y.
    Trejo, G.
    INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2011, 6 (05): : 1597 - 1616
  • [38] Bronze electrodeposition from an acidic non-cyanide high efficiency electrolyte: Tribological behavior
    Bengoa, L. N.
    Tuckart, W. R.
    Zabala, N.
    Prieto, G.
    Egli, W. A.
    SURFACE & COATINGS TECHNOLOGY, 2014, 253 : 241 - 248
  • [39] Electrodeposition of Sn and Au-Sn alloys from a single non-cyanide electrolyte
    He, A.
    Ivey, D. G.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2012, 23 (12) : 2186 - 2193
  • [40] A new condensation product for zinc plating from non-cyanide alkaline bath
    Y. Arthoba Naik
    T. V. Venkatesha
    Bulletin of Materials Science, 2005, 28 : 495 - 501