Effect of oxidation on indium solderability

被引：39

作者：

Kim, Jongman ^{[1
]}

Schoeller, Harry ^{[2
]}

Cho, Junghyun ^{[2
]}

Park, Seungbae ^{[2
]}

机构：

[1] Samsung Electromech Co, PKG Technol Team, Suwon 443743, Gyunggi Do, South Korea

[2] SUNY Binghamton, Dept Mech Engn, Binghamton, NY 13902 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2008年 / 37卷 / 04期

关键词：

indium; indium oxide; joint strength; reflow;

D O I：

10.1007/s11664-007-0346-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The fluxless solderability of pure indium on gold-coated surfaces is investigated in this study using measurements of wetting angle and joint strength. This study focuses on the effects of indium's native oxides and those which form during heat treatment. The initial oxide thicknesses are obtained by heating indium samples at various temperatures, and then, during the reflow above the melting temperature, oxidation at the interface is either allowed in open air or prevented by reflowing in an inert environment. The testing results presented include characterization of indium oxide (In2O3), the effects of indium oxide on joint strength, and the effect of hot pressing during reflow process.

引用

页码：483 / 489

页数：7

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