Thermal sensors cointegrated within a MEMS thermally actuated ultrathin membrane

被引：2

作者：

Salette, A. ^{[1
,2
,3
]}

Lefevre, R. ^{[1
,2
,3
]}

Agraffeil, C. ^{[1
,2
]}

Guillen, J. ^{[1
,2
]}

Dehan, C. ^{[3
]}

Morfouli, P. ^{[1
,2
]}

Montes, L. ^{[1
,2
]}

机构：

[1] Inst Microelect Electromagnetisme & Photon, F-38016 Grenoble 1, France

[2] LAb Hyperfrequences & Caracterisat IMEP LAHC, F-38016 Grenoble 1, France

[3] Eveon SAS, F-38330 Montbonnot St Martin, France

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2012年 / 22卷 / 06期

关键词：

SENSITIVITY; CIRCUIT; PIXEL; CHIP;

D O I：

10.1088/0960-1317/22/6/065029

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reports the simulation, design, fabrication and characterization of thermal sensors integrated into an ultrathin active MEMS membrane. Temperature detection is combined without any additional fabrication steps to thermal actuation. Mixing the actuation with a thermal measurement within the membrane allows us to monitor temperature during membrane deflection. Prototypes are fabricated using standard CMOS processes and a deep reactive ion etching process to release the membrane. Inner and outer actuation lead to large membrane deflection. Using such sensors, we extract the temperature profile of the thermally actuated membrane. A good fitting between finite element method simulation and characterization results validates the sensors. Finally, the optimal position of thermal sensors is extracted from this study.

引用

页数：9