Substrate integrated waveguide-to-microstrip transition in multilayer substrate

被引:48
|
作者
Ding, Yan [1 ]
Wu, Ke [1 ]
机构
[1] Ecole Polytech Montreal, Poly Grames Res Ctr, Dept Gen Elect, Montreal, PQ H3C 3A7, Canada
关键词
microstrip line; multilayer structure; ridged waveguide; substrate integrated circuits (SICs); substrate integrated waveguide (SIW); transition;
D O I
10.1109/TMTT.2007.909878
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a novel transition between a microstrip line and a substrate integrated waveguide (SIW) in a multilayer substrate design environment. In order to achieve a low-loss broadband response, the transition, considering both impedance matching and field matching. Characteristic impedance and guided wavelength calculated by using closed-form expressions based on a transverse resonant method are used to develop our design procedure. Effective broad bandwidth is obtained in two examples developed in this study, which are validated with simulated and measured results. This transition provides a simple way to design substrate integrated circuits with buried microstrip circuits in the multilayer substrate in which any ratio of impedance transform can be anticipated.
引用
收藏
页码:2839 / 2844
页数:6
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