Hydraulic and thermal performances of metal foam and pin fin hybrid heat sink

被引:59
作者
Li, Yongtong [1 ,2 ]
Gong, Liang [1 ]
Xu, Minghai [1 ]
Joshi, Yogendra [2 ]
机构
[1] China Univ Petr East China, Coll New Energy, Qingdao 266580, Peoples R China
[2] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA
基金
中国国家自然科学基金;
关键词
Metal foam; Pin fin; Heat sink; Numerical simulation; TRANSFER AUGMENTATION; MICROCHANNEL; FLOW; ELECTRONICS; CHANNELS;
D O I
10.1016/j.applthermaleng.2019.114665
中图分类号
O414.1 [热力学];
学科分类号
摘要
In this study, a metal foam and pin fin hybrid heat sink (MFPFH heat sink) is proposed for thermal management of high powered electronic devices. Thermo-hydraulic performance of MFPFH heat sink is numerically investigated under local thermal non-equilibrium condition, and compared with metal foam (MF) heat sink and traditional pin fin (PF) heat sink. Influences of MF morphological parameters on flow and heat transfer of MFPFH heat sink are analyzed, and the thermal performance ratio is evaluated. Thermal contact resistance between PFs and MF is introduced to explain its effects on the thermal performance of MFPFH heat sink for its practical application. Results indicate that significant heat transfer enhancement is achieved by using the MFPFH heat sink, due to the enhanced heat conduction and the improved heat convection by the common contribution of MF and PFs. Heat transfer characteristics of MFPFH heat sink are more sensitive to foam porosity, and pressure drop to pore size. By simultaneously considering the heat transfer enhancement and flow resistance increase, the thermal performance ratio of MFPFH heat sink is 1.6 times higher than the traditional PF heat sink. When thermal contact resistance is 10(-3) m(2).K/W, the degradation of average Nusselt number is approximately 36%.
引用
收藏
页数:9
相关论文
共 46 条
[1]   Thermo-fluid analysis of micro pin-fin array cooling configurations for high heat fluxes with a hot spot [J].
Abdoli, Abas ;
Jimenez, Gianni ;
Dulikravich, George S. .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2015, 90 :290-297
[2]   Electronic cooling using water flow in aluminum metal foam heat sink: Experimental and numerical approach [J].
Bayomy, A. M. ;
Saghir, M. Z. ;
Yousefi, T. .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2016, 109 :182-200
[3]   Finned metal foam heat sinks for electronics cooling in forced convection [J].
Bhattacharya, A ;
Mahajan, RL .
JOURNAL OF ELECTRONIC PACKAGING, 2002, 124 (03) :155-163
[4]  
Calmidi V.V, 1998, TRANSPORT PHENOMENA
[5]   Experimental study of heat sink performance using copper foams fabricated by electroforming [J].
Chein, Reiyu ;
Yang, Hsiharng ;
Tsai, Tsung-Hsun ;
Lu, Chijay .
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2010, 16 (07) :1157-1164
[6]   Numerical study of the inlet/outlet arrangement effect on microchannel heat sink performance [J].
Chein, Reiyu ;
Chen, Janghwa .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2009, 48 (08) :1627-1638
[7]   Heat transfer augmentation using a rib-dimple compound cooling technique [J].
Choi, Eun Yeong ;
Choi, Yong Duck ;
Lee, Won Suk ;
Chung, Jin Teak ;
Kwak, Jae Su .
APPLIED THERMAL ENGINEERING, 2013, 51 (1-2) :435-441
[8]   Assessing the influence of four bonding methods on the thermal contact resistance of open-cell aluminum foam [J].
De Jaeger, P. ;
T'Joen, C. ;
Huisseune, H. ;
Ameel, B. ;
De Schampheleire, S. ;
De Paepe, M. .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2012, 55 (21-22) :6200-6210
[9]   Modeling Forced Convection in Finned Metal Foam Heat Sinks [J].
DeGroot, Christopher T. ;
Straatman, Anthony G. ;
Betchen, Lee J. .
JOURNAL OF ELECTRONIC PACKAGING, 2009, 131 (02) :0210011-02100110
[10]   Metal foam hydrodynamics: Flow regimes from pre-Darcy to turbulent [J].
Dukhan, Nihad ;
Bagci, Ozer ;
Ozdemir, Mustafa .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2014, 77 :114-123