Electro-thermal and quantum analysis of CNT-based interconnections

Due to the rapid increases in current densities, wires, planar conductors and ground lines, become more and more vulnerable to electromigration. Future RF advanced packaging applications require new materials endowed of low electrical resistance, high reliability, chip-to-package interconnects, and improved thermal management. In this contribution, we introduce a multi-physics full-wave investigation of a CNT based interconnection bridging microstrips placed on different planar surface. The model include coupled i) electromagnetic, ii) quantum and iii) thermal analysis.