Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr

被引：24
|
作者：
Xiao, Zhengxiang [1 ]
Xue, Songbai [1 ]
Hu, Yuhua [1 ]
Ye, Huan [1 ]
Gao, Lili [1 ]
Wang, Hui [1 ]
机构：
[1] Nanjing Univ Aeronaut & Astronaut, Coll Mat Sci & Technol, Nanjing 210016, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2011年 / 22卷 / 06期
关键词：
WETTABILITY;
D O I：
10.1007/s10854-010-0192-x
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the present work, effects of trace amount of Pr on the microstructure, wettability and mechanical properties of Sn-9Zn solder were studied. The range of Pr content in Sn-9Zn solder alloys varied from 0.01 to 0.25 wt%. Test results indicate that adding appropriate amount of Pr can evidently improve the wettability and mechanical properties of the Sn-9Zn solder alloy. The Sn-9Zn-0.08Pr solder shows the best comprehensive properties compared to other solders with different Pr content. At the same time, notable changes in microstructure were found compared with the Pr-free alloy. The needle-like Zn-rich phase in the Sn-9Zn solder was refined and became more uniform. Moreover, the thickness of the IMC layer at Sn-9Zn/Cu substrate was remarkably depressed with Pr addition.
引用
收藏
页码：659 / 665
页数：7
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