Spectroscopic ellipsometry studies of buried CoSi2 layers in Si formed by ion implantation with a metal vapor vacuum arc ion source

被引:0
作者
Guo, WS [1 ]
机构
[1] Sichuan Univ, Opto Elect Dept Sci & Technol, Chengdu 610064, Peoples R China
关键词
ellipsometry; cobalt; silicides; ion implantation;
D O I
10.1016/S0040-6090(00)01242-6
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Co ion implantation into Si substrate with a metal vapor vacuum are (MEWA) ion source has been studied by spectroscopic ellipsometry (SE) over the wavelength range of 400-2000 nm. A series of samples synthesized at different substrate temperatures during implantation (T-S) and then post-annealed at the same conditions have been investigated. SE studies show that the buried CoSi2 layer shifts towards the surface and the surface roughness becomes thicker as T-S increases. Studies also show that, using MEVVA implantation, buried CoSi2 layers can be formed at relatively low T-S and relatively low annealing temperature. However, higher temperature annealing is essential for elimination of the damage in the top Si layer and formation of sharp interface. (C) 2000 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:280 / 283
页数:4
相关论文
共 23 条
[1]  
Azzam R., 1977, ELLIPSOMETRY POLARIZ
[2]   HIGH-CURRENT ION-SOURCE [J].
BROWN, IG ;
GAVIN, JE ;
MACGILL, RA .
APPLIED PHYSICS LETTERS, 1985, 47 (04) :358-360
[4]  
DU Q, 1998, LASER INFRARED, V28, P165
[5]   NEAR-INFRARED OPTICAL-PROPERTIES OF COSI2 THIN-FILMS [J].
DUBOZ, JY ;
BADOZ, PA ;
HENZ, J ;
VONKANEL, H .
JOURNAL OF APPLIED PHYSICS, 1990, 68 (05) :2346-2350
[6]  
Edwards D.F., 1985, Handbook of optical constants of solids
[7]   OPTICAL-PROPERTIES OF EPITAXIAL COSI2 AND NISI2 FILMS ON SILICON [J].
JIMENEZ, JR ;
WU, ZC ;
SCHOWALTER, LJ ;
HUNT, BD ;
FATHAUER, RW ;
GRUNTHANER, PJ ;
LIN, TL .
JOURNAL OF APPLIED PHYSICS, 1989, 66 (06) :2738-2741
[8]   OPTICAL-PROPERTIES OF BURIED COBALT DISILICIDE LAYERS IN SILICON [J].
LU, F ;
PERRY, CH ;
NAMAVAR, F .
JOURNAL OF APPLIED PHYSICS, 1994, 75 (11) :7465-7469
[9]  
Murarka S.P., 1983, Silicides for VLSI applications, P71
[10]  
NICOLET MA, 1983, MAT PROCESS CHARACTE, P6