Time-dependent dielectric breakdown of plasma-exposed porous organosilicate glass

被引：33
|
作者：
Nichols, M. T. [1 ,3 ]
Sinha, H. [1 ,3 ]
Wiltbank, C. A. [1 ,3 ]
Antonelli, G. A. [2 ]
Nishi, Y. [4 ]
Shohet, J. L. [1 ,3 ]
机构：
[1] Univ Wisconsin, Plasma Proc & Technol Lab, Madison, WI 53706 USA
[2] Novellus Syst, Tualatin, OR 97062 USA
[3] Univ Wisconsin, Dept Elect & Comp Engn, Madison, WI 53706 USA
[4] Stanford Univ, Stanford, CA 94305 USA
来源：
APPLIED PHYSICS LETTERS | 2012年 / 100卷 / 11期
基金：
美国国家科学基金会;
关键词：
VACUUM-ULTRAVIOLET SPECTRA; LOW-K; ABSOLUTE INTENSITIES; INTERLEVEL; FILMS; FAILURES;
D O I：
10.1063/1.3693526
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
Time-dependent dielectric breakdown (TDDB) is a major concern for low-k organosilicate dielectrics. To examine the effect of plasma exposure on TDDB degradation, time-to-breakdown measurements were made on porous SiCOH before and after exposure to plasma. A capillary-array window was used to separate charged particle and vacuum ultraviolet (VUV) photon bombardment. Samples exposed to VUV photons, and a combination of VUV photons and ion bombardment exhibited significant degradation in breakdown time. The samples exposed to VUV photons and ion bombardment showed more degradation in breakdown time in comparison to samples exposed to VUV photons alone. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.3693526]
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页数：4
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