Investigation of Simple Process Technology for the Fabrication of Valveless Micropumps

被引:3
作者
Yunas, Jumril [1 ]
Johari, Juliana [2 ]
Bahadorimehr, A. R. [1 ]
Gebeshuber, I. C. [1 ]
Majlis, Burhanuddin Yeop [1 ]
机构
[1] Univ Kebangsaan Malaysia, Inst Microengn & Nanoelect IMEN, Bangi 43600, Selangor, Malaysia
[2] Univ Teknol MARA, Shah Alam, Malaysia
来源
NEMS/MEMS TECHNOLOGY AND DEVICES | 2011年 / 254卷
关键词
Valveless micropump; MEMS; wet etching; adhesive bonding; SYSTEM;
D O I
10.4028/www.scientific.net/AMR.254.211
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a simple process technique for the fabrication of valveless micropumps. The process design utilizes standard MEMS process using double-sided anisotropic silicon wet etching process with an additional adhesive bonding technique. The diffuser and nozzle element of the pump with depth of 50 mu m, as well as a 150 mu m thick silicon membrane are designed and fabricated using only 3 patterning process steps. A piezoelectric plate working at the frequency range from 0.1 kHz to 2 kHz is bonded on to the back side of the silicon membrane to create the membrane actuation. The patterning process of thick photoresist used as the adhesive layer for the substrate bonding is also discussed in detail. The fluid flow is observed and the process reproducibility is proven which show a good prospect for the future development of miniaturized valveless pump for biomedical application.
引用
收藏
页码:211 / +
页数:2
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