Investigation of Optical Interconnection by using Photonic Wire Bonding

被引：5

作者：

Gu, ZhiChen ^{[1
]}

Amemiya, Tomohiro ^{[2
]}

Ishikawa, Atsushi ^{[3
]}

Atsumi, Yuki ^{[1
]}

Kang, JoonHyun ^{[1
]}

Hiratani, Takuo ^{[1
]}

Hayashi, Yusuke ^{[1
]}

Suzuki, Junichi ^{[1
]}

Nishiyama, Nobuhiko ^{[1
]}

Tanaka, Takuo ^{[3
]}

Arai, Shigehisa ^{[1
,2
]}

机构：

[1] Tokyo Inst Technol, Dept Elect & Elect Engn, Tokyo 1521552, Japan

[2] Tokyo Inst Technol, Quantum Nanoelect Res Ctr, Tokyo 1521552, Japan

[3] RIKEN, Metamat Lab, Saitama 3510198, Japan

来源：

JOURNAL OF LASER MICRO NANOENGINEERING | 2015年 / 10卷 / 02期

关键词：

Photonic integration; Photonic wire bonding; direct laser writing; III-V semiconductor; Si photonics; LASER; INP;

D O I：

10.2961/jlmn.2015.02.0007

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Photonic wire bonding based on direct laser writing of three-dimensional polymer structure was discussed as one of practical approaches for photonic integration of heterogeneous optical components. Here we assessed the coupling efficiency between photonic wire bond and III-V/Si optical components, and demonstrate the fabrication of photonic wire bond between two III-V semiconductor chips.

引用

页码：148 / 153

页数：6

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