CAD implications of new interconnect technologies

被引：7

作者：

Scheffer, Louis K. ^{[1
]}

机构：

[1] Cadence, San Jose, CA USA

来源：

2007 44TH ACM/IEEE DESIGN AUTOMATION CONFERENCE, VOLS 1 AND 2 | 2007年

关键词：

3D interconnect; nanotubes; on-chip optical;

D O I：

10.1109/DAC.2007.375230

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a replacement for metal interconnects, and optical interconnections for longer range on-chip communication. Each of these requires new CAD support to be used effectively.

引用

页码：576 / 581

页数：6

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