SnOx high-efficiency EUV interference lithography gratings towards the ultimate resolution in photolithography

被引:33
作者
Buitrago, Elizabeth [1 ]
Fallica, Roberto [1 ]
Fan, Daniel [1 ]
Kulmala, Tero S. [1 ]
Vockenhuber, Michaela [1 ]
Ekinci, Yasin [1 ]
机构
[1] Paul Scherrer Inst, Lab Micro & Nanotechnol, CH-5232 Villigen, Switzerland
关键词
EUVL; Interference lithography; Sn-oxide based resist; Inorganic resist; Direct patterning; Sub-10 nm resolution; Photolithography; Electron beam lithography; SCALAR DIFFRACTION THEORY; X-RAY WAVELENGTHS; EXTREME-ULTRAVIOLET; PATTERNS; ARRAYS; LIMITS;
D O I
10.1016/j.mee.2016.02.023
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We investigate a molecular Sn-oxide based negative tone resist featuring high absorbance at EUV wavelengths for the simple and direct fabrication of highly efficient diffraction gratings necessary for single-digit nm resolution patterning with EUV interference lithography (EUV-IL). In here we show for the first time, dense line space patterning by electron beam lithography down to 9 nm HP resolution using the novel Sn-oxide based resist. We furthermore show patterning of dense line-space structures down to 7 nm half-pitch resolution by the use of highly efficient SnOx gratings and EUV-IL Furthermore, our simulation results show the feasibility of patterning high-resolution nanostructures down to 5 nm half-pitch with optical lithography. (C) 2016 Elsevier B.V. All rights reserved.
引用
收藏
页码:44 / 49
页数:6
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