Ultraviolet laser ablation patterning of oxide films for optical applications

被引：9

作者：

Ihlemann, J ^{[1
]}

机构：

[1] Laser Lab Gottingen eV, D-37077 Gottingen, Germany

来源：

OPTICAL ENGINEERING | 2005年 / 44卷 / 05期

关键词：

ablation; excimer laser; layer stack; oxide film; dielectric mask; diffractive element;

D O I：

10.1117/1.1904602

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

Deep-UV (248 nm, 193 nm) excimer laser ablation is used to pattern thin oxide films or layer stacks. The ablation of extended areas as well as submicrometer structuring is possible. Due to their optical, chemical, and thermal stability, these inorganic films are better suited for optical applications compared to organic films, especially if UV transparency is required. The ablation of SiO2, Al2O3, HfO2, and Ta2O5 layers and combinations is investigated. Patterned films can be used as masks, diffractive phase elements, or gratings. (c) 2005 Society of Photo-Optical Instrumentation Engineers.

引用

页码：1 / 5

页数：5

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