Development of ultra-low fire COG and X7R dielectric compositions for multilayer ceramic chip capacitor and integrated passive component applications

A series of COG and X7R dielectric compositions have been developed which densify at temperatures below 1000 degrees C. These compositions have been demonstrated to be compatible with 90:10 and 95:5 AgPd internal electrode metal systems in multilayer ceramic capacitor devices. In addition these devices have been subjected to mechanical, electrical and environmental reliability testing and have exhibited failure rates that meet accepted industry standard pass/fail criteria. A feasibility study in which multiple dielectric constant materials were co-fired in a monolithic structure indicates that these materials are good candidates for integrated passive component applications. A multilayer ceramic capacitor cost model shows that when these materials are used with 95:5 AgPd the total material cost independent of processing cost is lower than the material cost for Ni electrode material systems.