Abnormal Cu3Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates

被引：9

作者：

Huang, T. S. ^{[1
]}

Tseng, H. W. ^{[1
]}

Hsiao, Y. H. ^{[1
]}

Cheng, C. H. ^{[1
]}

Lu, C. T. ^{[1
]}

Liu, C. Y. ^{[1
]}

机构：

[1] Natl Cent Univ, Dept Chem Engn & Mat Engn, Tao Yuan 32001, Taiwan

来源：

ELECTROCHEMICAL AND SOLID STATE LETTERS | 2011年 / 14卷 / 10期

关键词：

LEAD-FREE SOLDERS; VOID FORMATION; JOINTS; EVOLUTION;

D O I：

10.1149/1.3608248

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

(111) and (220) preferred-orientation Cu substrates were successfully produced by varying electroplating current-density. While these preferred-orientation Cu substrates reacted with Sn, serious Kirkendall voids formed at the interfaces between Sn and (111) and (220) preferred-orientation Cu substrates. Also, abnormal Cu3Sn growth occurs; the Cu3Sn layer decreased upon aging and vanished after 1000-h aging. With a prolonged 2000-h aging, a Cu3Sn layer re-grew at the Cu6Sn5/Cu interface. The abnormal Cu3Sn growth was found to highly associate with serious Kirkendall formation (C) 2011 The Electrochemical Society. [DOI: 10.1149/1.3608248] All rights reserved.

引用

页码：H393 / H396

页数：4

共 16 条

[1] Solid state interfacial reaction of Sn-37Pb and Sn-3.5Ag solders with Ni-P under bump metallization
He, M
Chen, Z
Qi, GJ
[J]. ACTA MATERIALIA, 2004, 52 (07) : 2047 - 2056
[2] Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers
Huang, K. C.
Shieu, F. S.
Huang, T. S.
Lu, C. T.
Chen, C. W.
Tseng, H. W.
Cheng, S. L.
Liu, C. Y.
[J]. JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (11) : 2403 - 2411
[3] Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints
Kim, J. Y.
Yu, Jin
Kim, S. H.
[J]. ACTA MATERIALIA, 2009, 57 (17) : 5001 - 5012
[4] Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
Laurila, T.
Vuorinen, V.
Paulasto-Krockel, M.
[J]. MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2010, 68 (1-2) : 1 - 38
[5] Effect of thermal aging on drop performance of chip scale packages with SnAgCu solder joints on Cu pads
Peng, Weiqun
Marques, Marco Elisio
[J]. JOURNAL OF ELECTRONIC MATERIALS, 2007, 36 (12) : 1679 - 1690
[6] Intermetallic compound formation between lead-free solders (Sn) and Cu or Ni electrodes
Sasaki, Tsutomu
Tanaka, Masamoto
Ohno, Yasuhide
[J]. MATERIALS LETTERS, 2007, 61 (10) : 2093 - 2095
[7] Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates
Shang, P. J.
Liu, Z. Q.
Pang, X. Y.
Li, D. X.
Shang, J. K.
[J]. ACTA MATERIALIA, 2009, 57 (16) : 4697 - 4706
[8] Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates
Wang, Y. W.
Lin, Y. W.
Kao, C. R.
[J]. MICROELECTRONICS RELIABILITY, 2009, 49 (03) : 248 - 252
[9] Condensation and Growth of Kirkendall Voids in Intermetallic Compounds
Weinberg, Kerstin
Boehme, Thomas
[J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2009, 32 (03): : 684 - 692
[10] KIRKENDALL voids in the intermetallic layers of solder joints in MEMS
Weinberg, Kerstin
Boehme, Thomas
Mueller, Wolfgang H.
[J]. COMPUTATIONAL MATERIALS SCIENCE, 2009, 45 (03) : 827 - 831

← 1 2 →