Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints

被引：21

作者：

Lin, Hsiu-Jen ^{[1
,2
]}

Chuang, Tung-Han ^{[1
]}

机构：

[1] Natl Taiwan Univ, Inst Mat Sci & Engn, Taipei 106, Taiwan

[2] Ind Technol Res Inst, Mech & Syst Res Labs, Hsinchu 310, Taiwan

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2010年 / 500卷 / 02期

关键词：

Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder; BGA packages; Au/Ni/Cu pads; Intermetallic compounds; Mechanical properties; LEAD-FREE SOLDER; SN-AG-CU; RARE-EARTH-ELEMENTS; SNAGCU SOLDER; TIN WHISKERS; ALLOYS; GROWTH; INTERMETALLICS; IMPROVEMENT;

D O I：

10.1016/j.jallcom.2010.03.233

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

It has been reported that the rapid growth of tin whiskers occurring on the surface of rare earth containing solders can be prevented by the addition of 0.5 wt.% Zn into a Sn-3Ag-0.5Cu-0.5Ce alloy. The present study shows that the tensile strength of Sn-3Ag-0.5Cu-0.5Ce alloy alloyed with Zn increases significantly in comparison to the Zn-free Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce solder. Moreover, the growth of intermetallic compounds at the solder/pad interfaces during the thermal aging at 100 degrees C and 150 degrees C was inhibited by the Zn addition. Nevertheless, the excess of Zn addition to 0.5 wt.% causes poor junction in the Sn-3Ag-0.5Cu-0.5Ce packages. An optimized addition amount of Zn in Sn-3Ag-0.5Cu-0.5Ce solders is 0.2 wt.% for both inhibiting the growth of tin whiskers and strengthening the solder joints, although its ductility is still lower than that of the original Sn-3Ag-0.5Cu. (C) 2010 Elsevier B.V. All rights reserved.

引用

页码：167 / 174

页数：8

共 22 条

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