Theoretical explanation of Ag/Cu and Cu/Ni nanoscale multilayers softening

被引：24

作者：

Ren, Fengzhang ^{[1
]}

Zhao, Shiyang ^{[1
]}

Li, Wuhui ^{[1
]}

Tian, Baohong ^{[1
]}

Yin, Litao ^{[1
]}

Volinsky, Alex A. ^{[2
]}

机构：

[1] Henan Univ Sci & Technol, Sch Mat Sci & Engn, Luoyang 471003, Peoples R China

[2] Univ S Florida, Dept Mech Engn, Tampa, FL 33620 USA

来源：

MATERIALS LETTERS | 2011年 / 65卷 / 01期

基金：

中国国家自然科学基金; 美国国家科学基金会;

关键词：

Multilayer structure; Hardness; Mechanical properties; Metals and alloys; Thin films; THIN-FILMS; MECHANICAL-PROPERTIES; DISLOCATION STABILITY; SIZE; COMPOSITES; STRENGTH; DEPENDENCE;

D O I：

10.1016/j.matlet.2010.09.063

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Relationship between metallic multilayers hardness and monolayer thickness has been investigated and explained for electroplated Ag/Cu and Cu/Ni multilayers using a modified Thomas-Fermi-Dirac electron theory Experiments reveal that the peak hardness of Ag/Cu multilayers occurs at the monolayer thickness of about 25 nm while the peak hardness of Cu/Ni multilayers occurs at about 50 nm Critical monolayer thickness corresponding to the peak hardness is approximated by the grain size limit of stable dislocations in Ag crystals for the Ag/Cu multilayers and in Cu crystals for Cu/Ni multilayers Grains size limits are calculated based on a modified Thomas-Fermi-Dirac electron theory Developed relationship between the critical monolayer thickness and the grains size limit helps understand nanoscale metallic multilayers softening (C) 2010 Elsevier B V All rights reserved

引用

页码：119 / 121

页数：3

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