Structure and properties of Ti-Si-N films prepared by ICP assisted magnetron sputtering

被引：42
作者：
Li, ZG
Mori, M
Miyake, S
Kumagai, M
Saito, H
Muramatsu, Y
机构：
[1] Osaka Univ, Joining & Welding Res Inst, Ibaraki, Osaka 5670047, Japan
[2] Kanagawa Ind Technol Res Inst, Kanagawa 2500055, Japan
[3] Kanagawa High Technol Fdn, Kawasaki, Kanagawa 2130012, Japan
来源：
SURFACE & COATINGS TECHNOLOGY | 2005年 / 193卷 / 1-3期
关键词：
sputtering; inductively coupled plasma; nanocomposite film; hardness;
D O I：
10.1016/j.surfcoat.2004.08.148
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Inductively coupled plasmas (ICPs) were generated to assist magnetron sputtering. By bombarding the growing film with a high-density (similar to 2.0 mA/cm(2)) low-energy (similar to 22 eV) ion flux, Ti-Si-N films containing 0-12 at.% Si were deposited on Si(100) substrates at low deposition temperature (< 150 degrees C). The residual compressive stresses of these films were measured to be lower than 1.5 GPa. Film hardness was significantly enhanced by the addition of a small amount of Si and attained a maximum value of 48 GPa at approximately 5.8 at.% Si. From X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) results, the superhard Ti-Si-N films were characterized as having a nanocomposite structure, consisting of nanocolumns of TiN crystallites with amorphous Si3N4 inside the column boundaries. The hardest TiSi-N film exhibited a pronounced TiN(200) texture. No refinement of crystallite size by the addition of Si was observed in the present series of Ti-Si-N films. Thus, the hardness enhancement was attributed to nanocomposite effect. (c) 2004 Elsevier B.V. All rights reserved.
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页码：345 / 349
页数：5
相关论文
共 30 条
[1]   EFFECTS OF HIGH-FLUX LOW-ENERGY (20-100 EV) ION IRRADIATION DURING DEPOSITION ON THE MICROSTRUCTURE AND PREFERRED ORIENTATION OF TI0.5AL0.5N ALLOYS GROWN BY ULTRA-HIGH-VACUUM REACTIVE MAGNETRON SPUTTERING [J].
ADIBI, F ;
PETROV, I ;
GREENE, JE ;
HULTMAN, L ;
SUNDGREN, JE .
JOURNAL OF APPLIED PHYSICS, 1993, 73 (12) :8580-8589
[2]   Influence of the sputtering gas on the preferred orientation of nanocrystalline titanium nitride thin films [J].
Banerjee, R ;
Chandra, R ;
Ayyub, P .
THIN SOLID FILMS, 2002, 405 (1-2) :64-72
[3]   Improving the properties of titanium nitride by incorporation of silicon [J].
Diserens, M ;
Patscheider, J ;
Levy, F .
SURFACE & COATINGS TECHNOLOGY, 1998, 108 (1-3) :241-246
[4]   Mechanical properties and oxidation resistance of nanocomposite TiN-SiNx physical-vapor-deposited thin films [J].
Diserens, M ;
Patscheider, J ;
Lévy, F .
SURFACE & COATINGS TECHNOLOGY, 1999, 120 :158-165
[5]  
GEORGE E, 1998, MECHANICAL METALLURG, P119
[6]   MICROSTRUCTURE AND PHYSICAL-PROPERTIES OF POLYCRYSTALLINE METASTABLE TI0.5AL0.5N ALLOYS GROWN BY DC MAGNETRON SPUTTER DEPOSITION [J].
HAKANSSON, G ;
SUNDGREN, JE ;
MCINTYRE, D ;
GREENE, JE ;
MUNZ, WD .
THIN SOLID FILMS, 1987, 153 :55-65
[7]   Microstructure and properties of Ti-Si-N nanocomposite films [J].
Hu, XP ;
Han, ZH ;
Li, GY ;
Gu, MY .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2002, 20 (06) :1921-1926
[8]   FORMATION OF POLYHEDRAL N2 BUBBLES DURING REACTIVE SPUTTER DEPOSITION OF EPITAXIAL TIN(100) FILMS [J].
HULTMAN, L ;
SUNDGREN, JE ;
GREENE, JE .
JOURNAL OF APPLIED PHYSICS, 1989, 66 (02) :536-544
[9]   Superhard Ti-Si-N coatings by a hybrid system of arc ion plating and sputtering techniques [J].
Kim, KH ;
Choi, SR ;
Yoon, SY .
SURFACE & COATINGS TECHNOLOGY, 2002, 161 (2-3) :243-248
[10]  
KIM SH, 2002, J MATER PROCESS TECH, V6311, P1
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