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Evaluation and analysis for mechanical strengths of low k dielectrics by a finite element method
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PROCEEDINGS OF THE IEEE 2002 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE,
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:72-74
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Porosity effects on low-k dielectric film strength and interfacial adhesion
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PROCEEDINGS OF THE IEEE 2002 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE,
2002,
:242-244
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X-ray and neutron porosimetry as powerful methodologies for determining structural characteristics of porous Low-k thin films
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PROCEEDINGS OF THE IEEE 2004 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE,
2004,
:136-138
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3-dimensional structures of pores in Low-k films observed by quantitative TEM tomograph and their impacts on penetration phenomena
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PROCEEDINGS OF THE IEEE 2004 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE,
2004,
:178-180