Antenna-in-Package Design Considerations for Ka-Band 5G Communication Applications

被引：179
作者：
Liu, Duixian [1 ]
Gu, Xiaoxiong [1 ]
Baks, Christian W. [1 ]
Valdes-Garcia, Alberto [2 ]
机构：
[1] IBM TJ Watson Ctr, Yorktown Hts, NY 10583 USA
[2] IBM TJ Watson Ctr, RE Circuits & Syst Grp, Yorktown Hts, NY 10583 USA
来源：
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION | 2017年 / 65卷 / 12期
关键词：
Antenna cavities; antenna-in-package (AiP); dual-polarized patch antennas; feed line transitions; high-density integration; phased-array; radio frequency integrated circuit (RFIC) package; PATCH ANTENNAS; CELLULAR COMMUNICATIONS; TECHNOLOGY; RADIATION; ARRAYS; LTCC;
D O I：
10.1109/TAP.2017.2722873
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Phased-array modules at frequencies >20 GHz are expected to play an important role for 5G applications. Antennain-package (AiP) is a reliable and cost-effective method to realize these phased arrays. This paper introduces a practical Ka-band AiP structure and discusses the antenna element design and implementation tradeoffs. The AiP design is based on multilayer organic buildup substrates that are suitable for phased-array module integration needs and supports both horizontal and vertical polarizations. Measurement results from the fabricated antenna prototypes show 0.8 GHz return loss bandwidth and 3.8-dBi peak gain at 30.5 GHz. Simulation results agree with the measured ones.
引用
收藏
页码：6372 / 6379
页数：8
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