Effects of Ti addition to Sn-Ag and Sn-Cu solders

被引：82

作者：

Chen, W. M. ^{[1
]}

Kang, S. K. ^{[2
]}

Kao, C. R. ^{[1
]}

机构：

[1] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei 10764, Taiwan

[2] IBM TJ Watson Res Ctr, Yorktown Hts, NY USA

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2012年 / 520卷

关键词：

Minor alloying elements; Pb-free solders; Ti addition; SNAGCU SOLDERS; NI ADDITIONS; TEMPERATURE; CU3SN; ZN; GROWTH; VOLUME;

D O I：

10.1016/j.jallcom.2012.01.032

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Minor alloying addition to solders has been an important strategy to improve the integrity and reliability of Pb-free solder joints. In this study, a small amount of Ti was added to Sn-Cu and Sn-Ag solders, and their microstructures, solidification behaviors, mechanical properties, and high temperature aging characteristics were investigated. Thermal analysis confirmed Ti addition being very effective in reducing the undercooling. Correlations between cooling rates, microstructure, and microhardness were established. One pronounced feature of Ti addition was that Ti-added solders had microstructures very stable against extreme aging conditions. (C) 2012 Elsevier B.V. All rights reserved.

引用

页码：244 / 249

页数：6

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