On the room-temperature annealing of cryogenically rolled copper

被引：51

作者：

Konkova, T. ^{[2
]}

Mironov, S. ^{[1
,2
]}

Korznikov, A. ^{[2
]}

Semiatin, S. L. ^{[3
]}

机构：

[1] Tohoku Univ, Dept Mat Proc, Grad Sch Engn, Sendai, Miyagi 9808579, Japan

[2] Russian Acad Sci, Inst Met Superplast Problems, Ufa 450001, Russia

[3] USAF, Res Lab, Mat & Mfg Directorate, AFRL RXLM, Wright Patterson AFB, OH 45433 USA

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2011年 / 528卷 / 24期

关键词：

Thermomechanical processing; EBSD; Non-ferrous alloys; Recrystallization; ELECTRON BACKSCATTER DIFFRACTION; RECRYSTALLIZED COPPER; FCC METALS; DEFORMATION; MICROSTRUCTURE; FRACTION; TEXTURE; ALLOYS; CU;

D O I：

10.1016/j.msea.2011.06.047

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The electron-backscatter-diffraction (EBSD) technique was applied to investigate room-temperature annealing processes in cryogenically rolled copper during long-term (similar to 1.5 years) storage at ambient temperature. Static recrystallization appeared to be nucleated as result of both grain-boundary bulging and recovery. A bimodal recrystallized grain size distribution appeared to be a result of these two competing mechanisms. The ultra-fine grain copper produced via cryogenic deformation was deduced to be prone to abnormal grain growth after long static storage at room-temperature. (C) 2011 Elsevier B.V. All rights reserved.

引用

页码：7432 / 7443

页数：12

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