An application of high-impedance ground planes to phased array antennas

被引：39

作者：

Broas, RFJ ^{[1
]}

Sievenpiper, DE ^{[1
]}

Yablonovitch, E ^{[1
]}

机构：

[1] Univ Calif Los Angeles, Dept Elect Engn, Los Angeles, CA 90095 USA

来源：

IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION | 2005年 / 53卷 / 04期

关键词：

bandgap; coupling; phased array antennas; surface; impedance; surface waves;

D O I：

10.1109/TAP.2005.844408

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The high-impedance surface was used as the antenna ground plane between two radiator elements to reduce the inter-element coupling between them. Measurement reveals the optimum performance occurred at the bandgap due to the suppression of surface currents in the ground plane.

引用

页码：1377 / 1381

页数：5

共 7 条

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Broas, RFJ ;

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[2]

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[4]

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Sievenpiper, D ;

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[6]

SIEVENPIPER D, 1999, Patent No. 6262495

[7]

Sievenpiper D. F., 1999, THESIS U CALIFORNIA

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