Wafer Map Failure Pattern Recognition and Similarity Ranking for Large-Scale Data Sets

被引:256
作者
Wu, Ming-Ju [1 ]
Jang, Jyh-Shing R. [2 ]
Chen, Jui-Long [3 ]
机构
[1] Natl Tsing Hua Univ, Dept Comp Sci, Hsinchu 30013, Taiwan
[2] Natl Taiwan Univ, Dept Comp Sci & Informat Engn, Taipei 10617, Taiwan
[3] Taiwan Semicond Mfg Co, Mfg Technol Ctr, Hsinchu 30078, Taiwan
关键词
Data models; image recognition; information retrieval; pattern recognition; semiconductor defects;
D O I
10.1109/TSM.2014.2364237
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Wafer maps can exhibit specific failure patterns that provide crucial details for assisting engineers in identifying the cause of wafer pattern failures. Conventional approaches of wafer map failure pattern recognition (WMFPR) and wafer map similarity ranking (WMSR) generally involve applying raw wafer map data (i. e., without performing feature extraction). However, because increasingly more sensor data are analyzed during semiconductor fabrication, currently used approaches can be inadequate in processing large-scale data sets. Therefore, a set of novel rotation- and scale-invariant features is proposed for obtaining a reduced representation of wafer maps. Such features are crucial when employing WMFPR and WMSR to analyze large-scale data sets. To validate the performance of the proposed system, the world's largest publicly accessible data set of wafer maps was built, comprising 811 457 real-world wafer maps. The experimental results show that the proposed features and overall system can process large-scale data sets effectively and efficiently, thereby meeting the requirements of current semiconductor fabrication.
引用
收藏
页码:1 / 12
页数:12
相关论文
共 29 条
[1]  
[Anonymous], 2006, Proceedings of the IEEE, DOI DOI 10.1109/N-SSC.2006.4785860
[2]  
[Anonymous], 2005, ACM SIGKDD Explorations Newsletter
[3]  
[Anonymous], 1993, Digital Image Processing
[4]   Wafer Classification Using Support Vector Machines [J].
Baly, Ramy ;
Hajj, Hazem .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2012, 25 (03) :373-383
[5]   Representation Learning: A Review and New Perspectives [J].
Bengio, Yoshua ;
Courville, Aaron ;
Vincent, Pascal .
IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE, 2013, 35 (08) :1798-1828
[6]   A neural-network approach to recognize defect spatial pattern in semiconductor fabrication [J].
Chen, FL ;
Liu, SF .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2000, 13 (03) :366-373
[7]   Data mining for yield enhancement in semiconductor manufacturing and an empirical study [J].
Chien, Chen-Fu ;
Wang, Wen-Chih ;
Cheng, Jen-Chieh .
EXPERT SYSTEMS WITH APPLICATIONS, 2007, 33 (01) :192-198
[8]   A system for online detection and classification of wafer bin map defect patterns for manufacturing intelligence [J].
Chien, Chen-Fu ;
Hsu, Shao-Chung ;
Chen, Ying-Jen .
INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, 2013, 51 (08) :2324-2338
[9]  
CORTES C, 1995, MACH LEARN, V20, P273, DOI 10.1023/A:1022627411411
[10]   Statistical methods for visual defect metrology [J].
Cunningham, SP ;
MacKinnon, S .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1998, 11 (01) :48-53