共 8 条
[3]
HEUMANN T, 1992, WERKSTOFF FORSCHUNG, V10
[4]
Kosevich V. M., 1994, Interface Science, V2, P247
[5]
Diffusion and intermetallics formation between Pd/Ag metallization and Sn/Pb/Ag solder in surface mount solder joints
[J].
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY,
1999, 57 (02)
:116-126
[6]
EFFECT OF TEMPERATURE ON LATTICE PARAMETER OF 25 PERCENT SILVER-75 PERCENT PALLADIUM ALLOY
[J].
PHILOSOPHICAL MAGAZINE,
1964, 9 (99)
:527-&
[8]
YOON DN, 1989, ANNU REV MATER SCI, V19, P43