Heterogeneous 3D Integration of MOEMS and ICs

被引：0

作者：

Niklaus, Frank ^{[1
]}

Fischer, Andreas C. ^{[1
]}

机构：

[1] KTH Royal Inst Technol, Dept Micro & Nanosyst, SE-10044 Stockholm, Sweden

来源：

2016 INTERNATIONAL CONFERENCE ON OPTICAL MEMS AND NANOPHOTONICS (OMN) | 2016年

关键词：

Wafer-level heterogeneous 3D integration; MEMS; MOEMS; CMOS; IC; micro-mirror arrays; bolometer arrays; MONOCRYSTALLINE-SILICON;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Heterogeneous integration of micro-opto-electromechanical systems (MOEMS) and integrated circuits (ICs) allows the combination of high-quality optical and photonic MOEMS materials such as monocrystalline silicon (Si) with standard CMOS-based electronic circuits in order to realize complex optical systems. In this paper, we will present examples of such heterogeneous optical systems, including CMO-Sintegrated SiGe bolometer arrays and CMOS-integrated Si micro-mirror arrays.

引用

页数：2

共 7 条

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